RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD, PREPREG AND LAMINATE

PROBLEM TO BE SOLVED: To provide a resin composition for printed circuit boards, excellent in adhesiveness to conductive layers formed by plating in spite of small surface unevennesses, heat resistance, moisture heat resistance and combustion resistance, and suitable for forming fine circuits.SOLUTI...

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Bibliographische Detailangaben
Hauptverfasser:	YOTSUYA SEIJI, OMORI TAKAFUMI, HASEBE KEIICHI
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a resin composition for printed circuit boards, excellent in adhesiveness to conductive layers formed by plating in spite of small surface unevennesses, heat resistance, moisture heat resistance and combustion resistance, and suitable for forming fine circuits.SOLUTION: The resin composition includes an aralkyl type epoxy resin (A), an aralkyl type phenolic resin (B), boehmite (C), silicone powder (D) and polyvinyl acetal (E).