SUBSTRATE FOR MOUNTING LIGHT EMITTING ELEMENT, LED PACKAGE, AND MANUFACTURING METHOD OF LED PACKAGE

PROBLEM TO BE SOLVED: To provide a substrate for mounting a light emitting element which enables flip chip mounting using a single sided wiring board, achieves good heat radiation, and easily makes LED packages into an individual piece, and to provide the LED package using the substrate for mounting...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	IMAI NOBORU, TAKAHASHI TAKESHI, NEMOTO MASANORI, KITAMURA TETSURO, ISAKA FUMIYA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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