SUBSTRATE FOR MOUNTING LIGHT EMITTING ELEMENT, LED PACKAGE, AND MANUFACTURING METHOD OF LED PACKAGE

PROBLEM TO BE SOLVED: To provide a substrate for mounting a light emitting element which enables flip chip mounting using a single sided wiring board, achieves good heat radiation, and easily makes LED packages into an individual piece, and to provide the LED package using the substrate for mounting the light emitting element and a manufacturing method of the LED package.SOLUTION: A substrate for mounting a light emitting element 2 includes: a pair of wiring patterns 22A, 22B formed on a surface 20a of a resin film 20 so as to have a mounting region 30 where an LED chip 3 is mounted and be arranged in a predetermined direction; and a pair of filling parts 23A, 23B which respectively contact with the pair of wiring patterns 22A, 22B. The pair of filling parts 23A, 23B has protruding parts 230, 231 which protrude outward from the pair of wiring patterns 22A, 22B when viewed from the surface 20a side of the resin film 20.