SUBSTRATE FOR MOUNTING LIGHT EMITTING ELEMENT AND LED PACKAGE

PROBLEM TO BE SOLVED: To provide a substrate for mounting a light emitting element which enables flip chip mounting using a single sided wiring board and is excellent in heat radiation performance, and to provide an LED package using the substrate for mounting the light emitting element.SOLUTION: A...

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Bibliographische Detailangaben
Hauptverfasser: IMAI NOBORU, NEMOTO MASANORI, KITAMURA TETSURO, TANOI MINORU, ISAKA FUMIYA
Format: Patent
Sprache:eng
Schlagworte:
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a substrate for mounting a light emitting element which enables flip chip mounting using a single sided wiring board and is excellent in heat radiation performance, and to provide an LED package using the substrate for mounting the light emitting element.SOLUTION: A substrate for mounting a light emitting element is a single sided wiring board including: an insulative substrate; a pair of wiring patterns which are formed on one surface of the substrate and separated from each other so as to form a first gap therebetween; a pair of through holes which penetrate the substrate in the thickness direction and are separated from each other so as to form a second gap therebetween; and a pair of filling parts made of a metal, which fills the pair of through holes so as to contact with the pair of wiring patterns and be exposed on the one surface and the opposite surface of the substrate. The respective filling parts of the pair of filling parts have horizontal projection areas that are 50% of or larger than areas of the respective wiring patterns of the pair of wiring patterns.