LIGHT EMITTING DEVICE PACKAGE AND LIGHTING SYSTEM INCLUDING THE SAME

PROBLEM TO BE SOLVED: To provide a light emitting device package including light emitting devices, which are flip-bonded to bottoms of cavities formed at different regions of a body, and a lighting system including the same.SOLUTION: A light emitting device package in an embodiment comprises: a body...

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Bibliographische Detailangaben
1. Verfasser: LEE BUEM YEON
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a light emitting device package including light emitting devices, which are flip-bonded to bottoms of cavities formed at different regions of a body, and a lighting system including the same.SOLUTION: A light emitting device package in an embodiment comprises: a body; a first cavity in a first region of the body; a second cavity in a second region of the body; first and second lead frames spaced apart from each other in the first cavity; second and third lead frames spaced apart from each other in the second cavity; a first light emitting device disposed on the first and second lead frames in the first cavity; a second light emitting device disposed on the second and third lead frames in the second cavity; and a molding member disposed in the first and second cavities.