SUBSTRATE FOR SUSPENSION, SUSPENSION, SUSPENSION WITH ELEMENT, HARD DISK DRIVE, AND METHOD FOR MANUFACTURING SUBSTRATE FOR SUSPENSION

PROBLEM TO BE SOLVED: To mainly provide a substrate for a suspension for suppressing the occurrence of a short circuit of metal bump parts adjacent to each other.SOLUTION: The substrate for a suspension of the invention has a metal support substrate, an insulation layer formed on the metal support s...

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1. Verfasser: OCHI KAZUNORI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To mainly provide a substrate for a suspension for suppressing the occurrence of a short circuit of metal bump parts adjacent to each other.SOLUTION: The substrate for a suspension of the invention has a metal support substrate, an insulation layer formed on the metal support substrate, and a wiring layer formed on the insulation layer. In the substrate for a suspension, the wiring layer has a terminal part for performing connection to an external circuit board, and includes a metal bump part having a first side and a second side in a longitudinal direction in a planar view on the terminal part, and at least one of the first side and the second side has a non-projecting shape in which a center part does not project more than both end parts in a planar view.