VERIFICATION APPARATUS AND VERIFICATION METHOD OF INFRARED THERMAL IMAGE ARRAY MODULE

PROBLEM TO BE SOLVED: To provide a verification apparatus and a verification method of infrared thermal image array module.SOLUTION: The verification apparatus and the verification method of the infrared thermal image array module includes a thermal image module specification design, epitaxial, and optical property verification 10, to calibrate an epitaxial parameter. A single sensing component manufacturing process and a temperature-changing photoelectric quantity measurement verification 20 are performed, and the epitaxial completes low-temperature temperature change and transformation measurement calibration of the sensing component. A focal plane array manufacturing process and its photoelectric uniformity are verified as a verification 30, and a dark current uniformity test is performed. Adhesion between the focal plane array and a signal reading integrated circuit, and a polishing manufacturing process verification 40 are performed, and indium adhesion is performed between a sensing module and the signal reading integrated circuit, to convert a photoelectric signal. A thermal image quality integration test verification 50 is performed, and optimum driving, control output parameter analysis, and measurement are adjusted. A thermal image array module model is performed, and bonding with a focal plane sensing array is performed, to thereby complete 60 an image sensing array module model.