MIXED MODE LIGANDS

PROBLEM TO BE SOLVED: To provide substrates comprising a solid support, a ligand, and a linker comprising at least one C, O, N, or S atom covalently connecting the solid support to the ligand, and also provide a method of using and manufacturing the substrates, and a device including the substrates....

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	SAMUEL NOCHUMSON, HASSAN AIT HADDOU, JONATHAN HAIGH, FRANK ONYEMAUWA
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOIDCHEMISTRY CHEMISTRY CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING METALLURGY ORGANIC CHEMISTRY PEPTIDES PERFORMING OPERATIONS PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL PHYSICS SEPARATION TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE TESTING THEIR RELEVANT APPARATUS TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide substrates comprising a solid support, a ligand, and a linker comprising at least one C, O, N, or S atom covalently connecting the solid support to the ligand, and also provide a method of using and manufacturing the substrates, and a device including the substrates.SOLUTION: Substrates comprise (a) a solid support, (b) a ligand represented by a formula (omitted), and (c) a linker comprising at least one C, O, N, or S atom covalently connecting the solid support to the ligand, at the position on the ligand represented by a wavy line.