INTERCONNECTOR

PROBLEM TO BE SOLVED: To provide an interconnector satisfying the following: (1) the interconnector is a chromium-free interconnector substantially containing no chromium which may cause a hexavalent chromium compound; (2) even if the interconnector contains at least one kind of transition metal sel...

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Bibliographische Detailangaben
Hauptverfasser: MATSUBAYASHI HIROSHI, TERATANI NAOMI, MATSUDA KAZUYUKI
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide an interconnector satisfying the following: (1) the interconnector is a chromium-free interconnector substantially containing no chromium which may cause a hexavalent chromium compound; (2) even if the interconnector contains at least one kind of transition metal selected from Ni, Fe, Co, and Cu, the transition metal does not form an insulating compound by reaction with other materials during calcining; and (3) conductivity reduction associated with conductive carrier reduction caused by charge compensation associated with the solid solution of the transition metal, especially conductivity reduction during operation in the medium temperature range of 600 to 900°C, is suppressed.SOLUTION: There is provided an interconnector containing: an oxide represented by the formula SrLnTiO, where Ln represents at least one kind of element selected from the group consisting of Y and lanthanoids, 0.05≤y≤0.40, and 0.8≤x+y≤1; and at least one kind of transition metal selected from Ni, Fe, Co, and Cu. The interconnector is Cr-free and comprises at least two-layered structure.