COMPONENT SUPPLY DEVICE AND ELECTRONIC COMPONENT ATTACHMENT DEVICE AND ELECTRONIC COMPONENT ATTACHMENT METHOD

PROBLEM TO BE SOLVED: To provide a component supply device in which a plurality of electronic components, especially in the same lot, can be sucked simultaneously by means of an attachment head having suction nozzles arranged in a circle, and to provide an electronic component attachment device and...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	URATA NAOKI, WATANABE HIROYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a component supply device in which a plurality of electronic components, especially in the same lot, can be sucked simultaneously by means of an attachment head having suction nozzles arranged in a circle, and to provide an electronic component attachment device and an electronic component attachment method.SOLUTION: The component supply device comprises a component arrangement section including a plurality of pockets for housing electronic components arranged in a circle, rotary means for rotating the plurality of pockets in a circle, and an opening through which an electronic component is carried into at least one pocket, and a component supply section including a component feed section for mounting the electronic component, and transportation means for transporting the electronic component to the opening, and supplying the electronic component to the pocket.