WIRING BOARD FOR ELECTRONIC COMPONENT INSPECTION DEVICE AND METHOD FOR MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a wiring board for an electronic component inspection device capable of easily arranging a plurality of pieces of surface wiring for connecting a pad for a probe with an external connection terminal to the same surface of a board body, shortening design and manufactu...

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1. Verfasser: ONO TOMOYOSHI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a wiring board for an electronic component inspection device capable of easily arranging a plurality of pieces of surface wiring for connecting a pad for a probe with an external connection terminal to the same surface of a board body, shortening design and manufacturing periods and being easily manufactured, and a method for manufacturing the same.SOLUTION: A wiring board 1 for an electronic component inspection device includes: a board body 2 which is constituted by laminating a plurality of ceramic layers s1, s2, and has a surface 3 and a rear surface 4 whose planar views are rectangle; a plurality of pads 5 for a probe which are formed on a center side 3a on the surface 3 of the board body 2 and on which a probe 16 is mounted; a plurality of external connection terminals 6 formed on a peripheral side 3b on the surface 3 of the board body 2 and outside the plurality of pads 5 for the probe; surface wiring 7 which individually connects between the pads 5 for the probe and the external connection terminals 6, and is formed on the surface 3 of the board body 2; and pieces of internal wiring 8, 9 formed between the ceramic layers s1, s2 of the board body 2, in which the pieces of internal wiring 8, 9 are at least one of a power source wiring layer 8 and a ground wiring layer 9.