WIRING SUBSTRATE WITH BUILT-IN COMPONENT

PROBLEM TO BE SOLVED: To provide a wiring substrate with a built-in component capable of suppressing electrical interference among a plurality of components built in a cavity of a core substrate.SOLUTION: This invention relates to a wiring substrate with a built-in component provided with a core sub...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: TSUKADA TETSUJI, YAMASHITA DAISUKE, HIGO ICHIEI
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a wiring substrate with a built-in component capable of suppressing electrical interference among a plurality of components built in a cavity of a core substrate.SOLUTION: This invention relates to a wiring substrate with a built-in component provided with a core substrate and a wiring lamination part. A cavity 50 formed in the core substrate has a shape including more than five corners in planar view, a plurality of components C are disposed in the cavity 50, and a resin filler 20 is filled in a gap part between an inner wall surface of the core substrate in which the cavity 50 is formed and the plurality of components C. Concerning an X direction and a Y direction substantially orthogonal to each other in planar view, a component C (1) having an electric path along the Y direction, a component C (2) having an electric path along the X direction are respectively disposed, and electrical interference between both components can be suppressed.