RESIN COMPOSITION FOR FORMING PROTECTIVE FILM, DRY FILM SOLDER RESIST, COVERLAY FILM, FLEXIBLE PRINTED WIRING BOARD AND MANUFACTURING METHOD OF FLEXIBLE PRINTED WIRING BOARD

PROBLEM TO BE SOLVED: To provide a resin composition for forming a protective film which can ensure a required flexibility when used in a printed wiring board and can form a protective film having a high heat resistance in a required region.SOLUTION: The resin composition for forming a protective fi...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	ASAI SHOGO
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CINEMATOGRAPHY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a resin composition for forming a protective film which can ensure a required flexibility when used in a printed wiring board and can form a protective film having a high heat resistance in a required region.SOLUTION: The resin composition for forming a protective film that forms the protective film of a flexible printed wiring board 1 is constituted to contain a first curable resin component 5a and a second curable resin component 5b having different hardening conditions or hardening characteristics. A protective film having a required deformability is formed by principally curing the first curable resin component, and a protective film having a required heat resistance is formed by curing the first curable resin component and the second curable resin component.