CURABLE EPOXY RESIN COMPOSITION

PROBLEM TO BE SOLVED: To provide a curable epoxy resin composition giving a cured product having excellent transparency, heat resistance, light resistance and crack resistance combinedly.SOLUTION: This curable epoxy resin composition includes an alicyclic epoxy compound (A), a monoallyldiglycidyl is...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: SUZUKI HIROYO
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator SUZUKI HIROYO
description PROBLEM TO BE SOLVED: To provide a curable epoxy resin composition giving a cured product having excellent transparency, heat resistance, light resistance and crack resistance combinedly.SOLUTION: This curable epoxy resin composition includes an alicyclic epoxy compound (A), a monoallyldiglycidyl isocyanurate compound (B) expressed by formula (1), at least one leveling agent (C) selected from the group consisting of a silicone-based leveling agent and a fluorine-based leveling agent, a curing agent (D) and a curing promotor (F). In formula, Rand Reach represents a hydrogen atom or a 1-8C alkyl group.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2013018921A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2013018921A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2013018921A3</originalsourceid><addsrcrecordid>eNrjZJB3Dg1ydPJxVXAN8I-IVAhyDfb0U3D29w3wD_YM8fT342FgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8V4BRgaGxgaGFpZGho7GRCkCACdGIjg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>CURABLE EPOXY RESIN COMPOSITION</title><source>esp@cenet</source><creator>SUZUKI HIROYO</creator><creatorcontrib>SUZUKI HIROYO</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide a curable epoxy resin composition giving a cured product having excellent transparency, heat resistance, light resistance and crack resistance combinedly.SOLUTION: This curable epoxy resin composition includes an alicyclic epoxy compound (A), a monoallyldiglycidyl isocyanurate compound (B) expressed by formula (1), at least one leveling agent (C) selected from the group consisting of a silicone-based leveling agent and a fluorine-based leveling agent, a curing agent (D) and a curing promotor (F). In formula, Rand Reach represents a hydrogen atom or a 1-8C alkyl group.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; SEMICONDUCTOR DEVICES ; THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><creationdate>2013</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20130131&amp;DB=EPODOC&amp;CC=JP&amp;NR=2013018921A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20130131&amp;DB=EPODOC&amp;CC=JP&amp;NR=2013018921A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SUZUKI HIROYO</creatorcontrib><title>CURABLE EPOXY RESIN COMPOSITION</title><description>PROBLEM TO BE SOLVED: To provide a curable epoxy resin composition giving a cured product having excellent transparency, heat resistance, light resistance and crack resistance combinedly.SOLUTION: This curable epoxy resin composition includes an alicyclic epoxy compound (A), a monoallyldiglycidyl isocyanurate compound (B) expressed by formula (1), at least one leveling agent (C) selected from the group consisting of a silicone-based leveling agent and a fluorine-based leveling agent, a curing agent (D) and a curing promotor (F). In formula, Rand Reach represents a hydrogen atom or a 1-8C alkyl group.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2013</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJB3Dg1ydPJxVXAN8I-IVAhyDfb0U3D29w3wD_YM8fT342FgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8V4BRgaGxgaGFpZGho7GRCkCACdGIjg</recordid><startdate>20130131</startdate><enddate>20130131</enddate><creator>SUZUKI HIROYO</creator><scope>EVB</scope></search><sort><creationdate>20130131</creationdate><title>CURABLE EPOXY RESIN COMPOSITION</title><author>SUZUKI HIROYO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2013018921A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2013</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>SUZUKI HIROYO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SUZUKI HIROYO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>CURABLE EPOXY RESIN COMPOSITION</title><date>2013-01-31</date><risdate>2013</risdate><abstract>PROBLEM TO BE SOLVED: To provide a curable epoxy resin composition giving a cured product having excellent transparency, heat resistance, light resistance and crack resistance combinedly.SOLUTION: This curable epoxy resin composition includes an alicyclic epoxy compound (A), a monoallyldiglycidyl isocyanurate compound (B) expressed by formula (1), at least one leveling agent (C) selected from the group consisting of a silicone-based leveling agent and a fluorine-based leveling agent, a curing agent (D) and a curing promotor (F). In formula, Rand Reach represents a hydrogen atom or a 1-8C alkyl group.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_JP2013018921A
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
SEMICONDUCTOR DEVICES
THEIR PREPARATION OR CHEMICAL WORKING-UP
title CURABLE EPOXY RESIN COMPOSITION
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-06T13%3A37%3A53IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=SUZUKI%20HIROYO&rft.date=2013-01-31&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2013018921A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true