CURABLE EPOXY RESIN COMPOSITION

PROBLEM TO BE SOLVED: To provide a curable epoxy resin composition giving a cured product having excellent transparency, heat resistance, light resistance and crack resistance combinedly.SOLUTION: This curable epoxy resin composition includes an alicyclic epoxy compound (A), a monoallyldiglycidyl is...

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1. Verfasser:	SUZUKI HIROYO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a curable epoxy resin composition giving a cured product having excellent transparency, heat resistance, light resistance and crack resistance combinedly.SOLUTION: This curable epoxy resin composition includes an alicyclic epoxy compound (A), a monoallyldiglycidyl isocyanurate compound (B) expressed by formula (1), at least one leveling agent (C) selected from the group consisting of a silicone-based leveling agent and a fluorine-based leveling agent, a curing agent (D) and a curing promotor (F). In formula, Rand Reach represents a hydrogen atom or a 1-8C alkyl group.