SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD

PROBLEM TO BE SOLVED: To provide a substrate treating apparatus for drying a substrate using a supercritical fluid, and a substrate treating method using the apparatus.SOLUTION: The substrate treating apparatus includes: a process chamber 2500 in which an organic solvent remaining on a substrate is dissolved using a fluid provided as a supercritical fluid to dry the substrate; and a recycling unit 4000 in which the organic solvent is separated from the fluid discharged from the process chamber to recycle the fluid. The method for treating a substrate includes the steps of: dissolving an organic solvent remaining on a substrate using a fluid provided as a supercritical fluid to dry the substrate; and separating the organic solvent from the fluid to recycle the fluid.