POWER MODULE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

POWER MODULE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a power module package allowing a semiconductor device expected to generate high heat and a semiconductor device generating relatively low heat to be thermally separated from each other, and a method for manufacturing the same.SOLUTION: A power module package 100 inc...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LEE YON-KI, KIM KYAN-SOO, CHOI SYONG MUN, PARK JON-KYUN, LIM CHAN-HYUN
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a power module package allowing a semiconductor device expected to generate high heat and a semiconductor device generating relatively low heat to be thermally separated from each other, and a method for manufacturing the same.SOLUTION: A power module package 100 includes: a base substrate 110 having grooves 111 formed between a plurality of semiconductor device mounting areas; semiconductor devices 130 mounted on the semiconductor device mounting areas of the base substrate 110; and a molding 160 formed on the base substrate 110 and in inner portions of the grooves 111.