SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

PROBLEM TO BE SOLVED: To provide a semiconductor device microfabricated and including a plug in an active region and a plug arranged outside the active region, which can assuredly form a framed insulation film and optimize functions such as conductivity.SOLUTION: A semiconductor device comprises: a...

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1. Verfasser: MAKI YUKIO
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a semiconductor device microfabricated and including a plug in an active region and a plug arranged outside the active region, which can assuredly form a framed insulation film and optimize functions such as conductivity.SOLUTION: A semiconductor device comprises: a semiconductor substrate SUB having a principal surface; an active region formed on the principal surface of the semiconductor substrate SUB; a gate connection region formed on a periphery of the active region when viewed from above; a first connection layer CT formed in regions sandwiched by a plurality of first transistors TG formed on the active region, for electrically connecting the first transistors TG and layers on an upper side of the first transistors TG; and a second connection layer SNC for electrically connecting a second transistor TG formed on the gate connection region and layers on an upper side of the second transistor TG. The first connection layer CT includes a first conductive part PP1a and a second conductive part PP2a. The second connection layer SNC includes a third conductive part PP2b.