FILM THICKNESS MEASURING APPARATUS AND FILM THICKNESS MEASURING METHOD

PROBLEM TO BE SOLVED: To provide a film thickness measuring apparatus capable of measuring a film thickness easily without etching and a film thickness measuring method.SOLUTION: A film thickness measuring apparatus comprises: a cutting section 1 for cutting a part of the film surface of a film S1 f...

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Bibliographische Detailangaben
Hauptverfasser:	SAKAUCHI YUYA, ANDRE CYMONE
Format:	Patent
Sprache:	eng
Schlagworte:	BORING COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOTDIRECTED TO A PARTICULAR RESULT DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g.ARRANGEMENTS FOR COPYING OR CONTROLLING MACHINE TOOLS MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OFPARTICULAR DETAILS OR COMPONENTS MEASURING MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PHYSICS TESTING TRANSPORTING TURNING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a film thickness measuring apparatus capable of measuring a film thickness easily without etching and a film thickness measuring method.SOLUTION: A film thickness measuring apparatus comprises: a cutting section 1 for cutting a part of the film surface of a film S1 formed on a substrate S to expose a substrate surface and a measuring section for measuring a film thickness of the film by measuring the difference in levels of the exposed substrate surface and the film surface. The cutting section 1 has a blade section 20 on which a blade 21 for cutting a film surface is mounted; a moving means for moving the blade section 20; and pressing means for pressing the blade 21 to the substrate. In a state in which the blade 21 is pressed to the substrate S by the pressing means, a part of the film surface is cut by moving the blade section 20.