LASER CUTTING METHOD AND LASER CUTTING DEVICE

PROBLEM TO BE SOLVED: To prevent adverse effects to a cutting surface due to self-burning and the like caused by excess oxygen, to reduce an oxygen gas that does not contribute to cutting, and to maintain working precision.SOLUTION: This laser cutting device 1 that irradiates a laser beam 3a to a cu...

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Bibliographische Detailangaben
Hauptverfasser:	KOIKE TETSUO, YOSHII TAKAMICHI, OMORI KO, KOBAYASHI AI
Format:	Patent
Sprache:	eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To prevent adverse effects to a cutting surface due to self-burning and the like caused by excess oxygen, to reduce an oxygen gas that does not contribute to cutting, and to maintain working precision.SOLUTION: This laser cutting device 1 that irradiates a laser beam 3a to a cutting target material 2 and performs cutting while the oxygen gas is ejected to a cut point 2a irradiated with the laser beam 3a and to the vicinity of the cut point 2a, includes: a plurality of nozzle tips 5 provided around a nozzle tip 4 for emitting the laser beam 3a; a control unit that determines the nozzle tips 5 placed at the front and rear in a cutting progression direction of the cutting point 2a among the plurality of nozzle tips 5; and a gas supplying unit 8 that supplies the oxygen gas of high pressure to the nozzle tips 5 placed at the front and rear in the cutting progression direction of the cutting point 2a determined by the control unit 6, and supplies the oxygen gas of low pressure to the nozzle tips 5 placed in parts other than the front and rear of the cutting point 2a in the cutting progression direction.