VERIFICATION DEVICE AND VERIFICATION METHOD FOR INFRARED THERMAL IMAGE ARRAY MODULE

PROBLEM TO BE SOLVED: To provide a verification device and a verification method for an infrared thermal image array module.SOLUTION: The verification device and a verification method for an infrared thermal image array module mainly include a thermal image module specification design, epitaxial, and optical property verification, and first of all, an epitaxial parameter is calibrated. A single quick-close type sensing component manufacturing process and temperature-changing photoelectric quantity measurement verification are performed, and hereby the epitaxial completes low-temperature temperature change and transformation measurement calibration of a sensing component. A focal plane array manufacturing process and its photoelectric uniformity are verified, and a dark current uniformity test is performed. Adhesion between a focal plane array and a signal reading integrated circuit and a polishing manufacturing process are verified, and indium adhesion is performed between a sensing module and the signal reading integrated circuit, and thereby a photoelectric signal is converted. A thermal image quality integration test verification is performed, and optimum driving, control output parameter analysis and measurement are adjusted. A thermal image array module model is performed continuously, and bonding with a focal plane sensing array is performed by utilizing an indium pillar bonding system, to thereby complete an image sensing array module model.