LAMINATED BOARD, METAL-FOILED LAMINATED BOARD, PRINTED WIRING BOARD AND CIRCUIT BASE BOARD, LED BACKLIGHT UNIT, LED LIGHTING DEVICE AND MANUFACTURING METHOD OF LAMINATED BOARD

PROBLEM TO BE SOLVED: To provide a laminated board which does not impair a heat resistance property and drill processability and is high in heat dissipation performance.SOLUTION: The laminated board contains 80 to 150 pts.vol. of an inorganic filler with respect to 100 pts.vol. of a thermosetting resin. The inorganic filler contains gibbsite-type aluminum hydroxide particles (A) and a particle component (B). The gibbsite-type aluminum hydroxide particles (A) have 2 to 15 μm of average particle diameters (D). The particle component (B) is composed of aluminum oxide particles having 1.5 μm or smaller of average particle diameters (D). In the density distribution of the particle component (B), the distribution not smaller than 5 μm in particle diameter is not larger than 5 mass%, the distribution not smaller than 1 μm to smaller than 5 μm in particle diameter is not larger than 40 mass%, and the distribution smaller than 1 μm in particle diameter is not smaller than 55 mass%. The particle component (B) contains not smaller than 30 mass% of crushed aluminum oxide particles. A compound ratio (volume ratio) between the gibbsite-type aluminum hydroxide particles (A) and the particle component (B) is 1:0.2 to 0.5.