METHOD FOR MANUFACTURING CONDUCTIVE BASE MATERIAL

PROBLEM TO BE SOLVED: To provide a method for more simply manufacturing a conductive base material having excellent conductivity.SOLUTION: The method for manufacturing the conductive base material includes a step for transferring a conductive layer to a base material from a conductive film provided...

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Bibliographische Detailangaben
1. Verfasser:	TOKUNAGA TSUKASA
Format:	Patent
Sprache:	eng
Schlagworte:	AUXILIARY PROCESSES IN PHOTOGRAPHY BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CINEMATOGRAPHY CONDUCTORS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY INSULATORS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR,STEREO-PHOTOGRAPHIC PROCESSES PHOTOGRAPHY PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES PHYSICS PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method for more simply manufacturing a conductive base material having excellent conductivity.SOLUTION: The method for manufacturing the conductive base material includes a step for transferring a conductive layer to a base material from a conductive film provided with a temporary support and the conductive layer which is provided at the temporary support and includes a metal silver section. The metal silver section is formed by exposing a silver salt-containing emulsion layer containing silver halide and a binder and applying development treatment to the layer. The method for manufacturing the conductive base material includes a process for sticking the conductive film and the base material to each other so that the temporary support of the conductive film is located at the outside and a process for exfoliating the temporary support from the conductive layer.