CHIP TYPE MULTILAYER CAPACITOR

PROBLEM TO BE SOLVED: To provide a chip type multilayer capacitor that achieves size reduction and higher capacity while reducing acoustic noise.SOLUTION: A chip type multilayer capacitor according to an embodiment of the present invention comprises: a ceramic main body including a stack of dielectric layers each formed with a thickness of 3 μm or less, which is greater than or equal to 10 times of the average size of a grain; first and second external electrodes having different polarities from each other and formed at both ends of the ceramic main body in the length direction; a first internal electrode having one end forming a first margin with one end face of the ceramic main body to be provided with the second external electrode, and the other end being extracted by the first external electrode; and a second internal electrode having one end forming a second margin with the other end face of the ceramic main body to be provided with the first external electrode, and the other end being extracted by the second external electrode. The first margin and the second margin have different widths under a condition within 200 μm.