FORMATION METHOD OF Sn-Ag BASED ALLOY SOLDER BUMPS

PROBLEM TO BE SOLVED: To provide a formation method of solder bumps which keeps the composition of metal components constant when the solder bumps, having a pattern with a high aspect ratio, are formed by an Sn-Ag based alloy.SOLUTION: In a formation method, openings 13 are formed on electrodes 11,...

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Bibliographische Detailangaben
Hauptverfasser:	MASUDA AKIHIRO, HATTA KENJI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a formation method of solder bumps which keeps the composition of metal components constant when the solder bumps, having a pattern with a high aspect ratio, are formed by an Sn-Ag based alloy.SOLUTION: In a formation method, openings 13 are formed on electrodes 11, formed on a surface of a wafer 1, by a resist layer 12, and a plating liquid of an Sn-Ag alloy is supplied to the openings 13 by electrolytic plating to form solder bumps 15. The Ag concentration is set so as to be higher than an initial setting concentration according to the rise of the acid concentration in the plating liquid.