METHOD OF MANUFACTURING ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic component which can form a protrusion-like conductor having high connection reliability on a surface layer electrode.SOLUTION: A cover layer part 108 of a ceramic capacitor is formed in a state that a plurality of level differe...

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Bibliographische Detailangaben
Hauptverfasser: SEKI TOSHITAKE, KATO ATSUSHI, OTSUKA ATSUSHI, YAMAMOTO HIROSHI
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic component which can form a protrusion-like conductor having high connection reliability on a surface layer electrode.SOLUTION: A cover layer part 108 of a ceramic capacitor is formed in a state that a plurality of level difference correcting insulation layers 151 are interposed between ceramic insulation layers 150 at positions corresponding to a circumference of each via-conductor 131. During exposure of a photoresist film 180, the exposure is performed so that a laser 202 entered in order to expose to light an outside region R2 of a predetermined formation region R1 for forming a protrusion-like conductor hits a surface layer electrode 111 and changes its orientation, and is reflected toward the outside region R2 opposite the predetermined formation region R1. A plating resist for obtaining an opening is formed by developing the photoresist film 180, and the protrusion-like conductor is formed by plating the surface layer electrode 111 that is exposed via the opening.