WIRING BODY AND MANUFACTURING METHOD THEREFOR

PROBLEM TO BE SOLVED: To provide a wiring body in which a flexible printed wiring board on which an electronic component is mounted by solder reflow is stacked on a metal structure and bonded thereto without inhibiting heat dissipation.SOLUTION: The wiring body 100 constituted by stacking a flexible...

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Bibliographische Detailangaben
Hauptverfasser:	SAITO HIROHISA, AKAHA YOSHIHIRO, UENISHI NAOTA, YAMAMOTO MASAMICHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a wiring body in which a flexible printed wiring board on which an electronic component is mounted by solder reflow is stacked on a metal structure and bonded thereto without inhibiting heat dissipation.SOLUTION: The wiring body 100 constituted by stacking a flexible printed wiring board 1 having an electronic component 5 mounted thereon on a heat dissipation metal structure 15 comprises a reinforcement copper foil layer 12 provided on the rear side of the region of the flexible printed wiring board where the electronic component is mounted and having a thickness of 35 μm or more, and an adhesive layer 16 which makes the flexible printed wiring board adhere to the metal structure. The bubble fraction in the adhesive layer between the reinforcement copper foil layer and the metal structure is set smaller than the bubble fraction of the adhesive layer in other region.