SUBSTRATE MOUNTING COMPONENT AND SUBSTRATE MOUNTING COMPONENT MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a substrate mounting component which enables the accuracy of coplanarity to be easily improved and also enables characteristics inspection to be conducted before mounting, and to provide a manufacturing method which improves the manufacturability of the substrate mou...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	IKETANI KENICHI, HIKOSAKA TOMOHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CURRENT COLLECTORS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINE CONNECTORS OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PHYSICS SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!