SUBSTRATE MOUNTING COMPONENT AND SUBSTRATE MOUNTING COMPONENT MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a substrate mounting component which enables the accuracy of coplanarity to be easily improved and also enables characteristics inspection to be conducted before mounting, and to provide a manufacturing method which improves the manufacturability of the substrate mou...

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Bibliographische Detailangaben
Hauptverfasser:	IKETANI KENICHI, HIKOSAKA TOMOHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CURRENT COLLECTORS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINE CONNECTORS OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PHYSICS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a substrate mounting component which enables the accuracy of coplanarity to be easily improved and also enables characteristics inspection to be conducted before mounting, and to provide a manufacturing method which improves the manufacturability of the substrate mounting component.SOLUTION: An optical connector 2 serving as a substrate mounting component is surface-mounted on a circuit board 1 with multiple conductive lead frames 21, which serve as wires, led out. The multiple lead frames 21 are fixed all at once by an insulative flatness securing part 23. The flatness securing part 23 is formed so as to extend in the arrangement direction of the multiple lead frames 21. The flatness securing part 23 may be provided so as to be fastened to the multiple lead frames 21 or may be detachably provided.