FORCE SENSOR CHIP

PROBLEM TO BE SOLVED: To provide a force sensor chip which does not cause a failure of anodic bonding and damage to a sensor circuit during the anodic bonding.SOLUTION: A force sensor chip includes: a base member 2 which is made of a semiconductor substrate and which includes an action part 4 having...

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Bibliographische Detailangaben
1. Verfasser:	SAKURAI NOBUHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	MEASURING MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE PHYSICS TESTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a force sensor chip which does not cause a failure of anodic bonding and damage to a sensor circuit during the anodic bonding.SOLUTION: A force sensor chip includes: a base member 2 which is made of a semiconductor substrate and which includes an action part 4 having an external force acting region part 4A, a support part 3 supporting the action part 4, and connection parts connecting the action part 4 and the support part 3; distortion detecting resistance elements S provided at deformation generation portions of the connection parts; and anodic bonding electrodes 8 to which an electric current is supplied during anodic bonding and which are provided on a surface of the action part 4 or a reverse side of a surface where the action part 4 is formed.