RESIN COMPOSITION FOR ELECTRONIC CIRCUIT BOARD MATERIAL, PREPREG AND LAMINATED PLATE

PROBLEM TO BE SOLVED: To provide a resin composition for electronic circuit board material which is excellent in moldability, has a high glass transition temperature (Tg) in a hardened material thereof, and can reduce warpage in production of a semiconductor package.SOLUTION: The resin composition f...

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Hauptverfasser:	HANAZAKI SHOHEI, TAKAHASHI TATSUSHI, MOTOBE EIJI, TARUKAWA KAZUHIRO, HIROKAWA YUKI
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP
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Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a resin composition for electronic circuit board material which is excellent in moldability, has a high glass transition temperature (Tg) in a hardened material thereof, and can reduce warpage in production of a semiconductor package.SOLUTION: The resin composition for electronic circuit board material contains (A) a phenolic resin; (B) an epoxy resin; and (C) an inorganic filler. The component (A) contains a novolac phenolic resin which has two or more hydroxyl groups in the molecule and has a naphthalene framework having at least one hydroxyl group of the hydroxyl groups. The component (B) contains a polyfunctional epoxy resin having two or more epoxy groups in the molecule. The content of the component (C) to 100 pts.mass of the components (A) and (B) is 130-250 pts.mass. The glass transition temperature (Tg) after hardened is 220°C or higher.