TERMINAL CONNECTION METHOD OF ELECTRIC WIRING BOARD, AND TERMINAL CONNECTION STRUCTURE OF ELECTRIC WIRING BOARD

PROBLEM TO BE SOLVED: To provide a terminal connection structure of an electric wiring board and a terminal connection method of an electric wiring board capable of, in the electric wiring board, electrically connecting terminals to be conductive together at a low cost, and capable of assuring a con...

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Hauptverfasser: KAWAHARA HISAYA, HIEI ATSUSHI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a terminal connection structure of an electric wiring board and a terminal connection method of an electric wiring board capable of, in the electric wiring board, electrically connecting terminals to be conductive together at a low cost, and capable of assuring a conductive state between the connected terminals even if a vibration is propagated to the electric wiring board.SOLUTION: In the terminal connection method of an electric wiring board, first and second solder layers 12 and 22 are formed at a first terminal 11 of a first electric wiring board 10 and a second terminal 21 of a second electric wiring board 20. The cross section area of tip parts 30A and 30B of a spring 30 that are made to contact to the first and second solder layers 12 and 22 is formed smaller than the cross section area of a deformation part 31 of the spring 30. Under such condition as the tip parts 30A and 30B are made to contact to the first and second solder layers 12 and 22 and the spring 30 is made to energize the first and second solder layers 12 and 22, the spring 30 is electrified to melt the first and second solder layers 12 and 22, thereby jointing the tip parts 30A and 30B of the spring 30 to the first and second solder layers 12 and 22.