VACUUM PROCESSING APPARATUS

PROBLEM TO BE SOLVED: To provide a vacuum processing apparatus which can improve the throughput of deposition processing, and can perform a plurality of kinds of processing at the same time.SOLUTION: The vacuum processing apparatus 1 transports a material S to be processed along a transfer route R i...

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Bibliographische Detailangaben
Hauptverfasser:	YAMANAKA KAZUTO, HIRAMATSU SHOGO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a vacuum processing apparatus which can improve the throughput of deposition processing, and can perform a plurality of kinds of processing at the same time.SOLUTION: The vacuum processing apparatus 1 transports a material S to be processed along a transfer route R in a condition that the material is held on a carrier 3, and performs prescribed vacuum processing in a plurality of process chambers disposed along the transfer route R, wherein the material S to be processed held on the carrier 3 is replaced in a plurality of turnabout chambers disposed in each corner part on the transfer route R.