POST-TREATMENT AGENT FOR TIN OR TIN ALLOY PLATING FILM, AND METHOD FOR TREATING TIN OR TIN ALLOY PLATING FILM

PROBLEM TO BE SOLVED: To provide a post-treatment agent by which a tin or tin alloy plating film can be suppressed from discoloration under high-humidity and high-temperature conditions, deterioration of solder wettability, and discoloration by reflow oxidation, thereby capable of improving the reli...

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Bibliographische Detailangaben
Hauptverfasser:	IKUMOTO RAIHEI, KANO TOSHIKAZU, TSUJIMOTO MASANORI, KISO MASAYUKI, KANAMORI GENKI
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS SOLDERING OR UNSOLDERING SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a post-treatment agent by which a tin or tin alloy plating film can be suppressed from discoloration under high-humidity and high-temperature conditions, deterioration of solder wettability, and discoloration by reflow oxidation, thereby capable of improving the reliability of solder bonding of electronic parts.SOLUTION: The post-treatment agent includes: one or more anionic surfactants selected from among a polyoxyalkylene alkylether phosphate, a polyoxyalkylene alkylphenyl ether phosphate, a polyoxyalkylene phenyl ether phosphate, a polyoxyalkylene naphthyl ether phosphate, a polyoxyalkylene styrenated phenyl ether phosphate, and a salt thereof; and one or more phosphoric acid compounds selected from among phosphoric acid, condensed phosphoric acid, phosphorous acid, hypophosphorous acid, and a water soluble salt thereof.