SEMICONDUCTOR DEVICE, PACKAGING STRUCTURE AND MANUFACTURING METHOD OF PACKAGING STRUCTURE

PROBLEM TO BE SOLVED: To provide a semiconductor device capable of reducing failure occurrence.SOLUTION: The semiconductor device includes: an electrode 103; an Ag layer 201 formed in a part on the electrode 103; a Ni layer 202 formed on the electrode 103 around the Ag layer 201; a semiconductor ele...

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Bibliographische Detailangaben
Hauptverfasser:	FUJIWARA SEIJI, FURUSAWA AKIO, NAKAMURA TAICHI, MATSUO TAKAHIRO, SAKATANI SHIGEAKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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