POLYAMIDEIMIDE RESIN INSULATION COATING MATERIAL AND INSULATION WIRE USING THE SAME

PROBLEM TO BE SOLVED: To provide a polyamideimide resin insulation coating material which has a high partial discharge inception voltage by achieving a low dielectric constant while maintaining heat resistance, mechanical properties, oil resistance, etc., and to provide an insulation wire using the...

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Hauptverfasser: KIKUCHI HIDEYUKI, YUKIMORI YUZO
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a polyamideimide resin insulation coating material which has a high partial discharge inception voltage by achieving a low dielectric constant while maintaining heat resistance, mechanical properties, oil resistance, etc., and to provide an insulation wire using the same.SOLUTION: The polyamideimide resin insulation coating material is obtained by dissolving in a polar solvent, a polyamideimide resin not containing a halogen atom in the molecular chain. The polyamideimide resin is obtained by: blending an aromatic diisocyanate component (B) having two or less benzene rings to an aromatic imide prepolymer including an amine component comprising only an aromatic diamine component (E) having three or more benzene rings and an acid component comprising an aromatic tricarboxylic acid anhydride (C) and an aromatic tetracarboxylic acid dianhydride (D) as a monomer; and reacting them. The ratio M/N of a molecular weight (M) per repeating unit of the polyamideimide resin to average pieces (N) of amide groups and imide groups is 200 or more.