SUBSTRATE FOR PRINTED WIRING BOARD AND MANUFACTURING METHOD OF THE SAME

PROBLEM TO BE SOLVED: To provide a substrate for a printed wiring board which has a conductive layer including metal particles and causes only small deterioration of peeling strength after being left at high temperature, and a manufacturing method of the substrate for the printed wiring board.SOLUTI...

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Bibliographische Detailangaben
Hauptverfasser:	KASUGA TAKASHI, OKA YOSHIO, UENISHI NAOTA
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a substrate for a printed wiring board which has a conductive layer including metal particles and causes only small deterioration of peeling strength after being left at high temperature, and a manufacturing method of the substrate for the printed wiring board.SOLUTION: A substrate for a printed wiring board includes: an insulation base material 10; a first conductive layer formed by laminating metal particles 22A on the insulation base material 10; and a second conductive layer laminated on the first conductive layer. The metal particles 22A of the first conductive layer are covered by an oxidation inhibitor 30 inhibiting oxidation of the metal particles 22A.