METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device which accurately determines whether a wafer is damaged or not without incurring damage during the determination.SOLUTION: Without bringing an acoustic signal generator 4 into contact with a wafer 1 in which a semicondu...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	NAKADA KAZUNARI, TERASAKI YOSHIAKI
Format:	Patent
Sprache:	eng
Schlagworte:	INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING PHYSICS TESTING
Online-Zugang:	Volltext bestellen
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