METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device which accurately determines whether a wafer is damaged or not without incurring damage during the determination.SOLUTION: Without bringing an acoustic signal generator 4 into contact with a wafer 1 in which a semicondu...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: NAKADA KAZUNARI, TERASAKI YOSHIAKI
Format: Patent
Sprache:eng
Schlagworte:
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES
MEASURING
PHYSICS
TESTING
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device which accurately determines whether a wafer is damaged or not without incurring damage during the determination.SOLUTION: Without bringing an acoustic signal generator 4 into contact with a wafer 1 in which a semiconductor device is provided, an acoustic signal generated by the acoustic signal generator 4 is inputted to the wafer 1. Next, an acoustic signal containing a sound resonated with the wafer 1 is detected. Then, data indicating a strength of each frequency component in the detected acoustic signal is determined and the data is compared to data in which there is no damage in the wafer, thereby determining whether the wafer 1 is damaged or not.