METHOD OF PROCESSING FRAGILE MATERIAL SUBSTRATE

PROBLEM TO BE SOLVED: To reduce poor cutting in forming lattice scribe grooves in a fragile material substrate having a relatively large linear expansion coefficient and cutting.SOLUTION: The processing method is for irradiating a fragile material substrate with a pulse laser beam along lattice line...

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Bibliographische Detailangaben
Hauptverfasser:	FUKUHARA KENJI, OKAMOTO HIROKAZU, ARAKAWA MIKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GLASS MACHINE TOOLS MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY MINERAL OR SLAG WOOL PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE TRANSPORTING WELDING WORKING BY LASER BEAM WORKING CEMENT, CLAY, OR STONE WORKING STONE OR STONE-LIKE MATERIALS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To reduce poor cutting in forming lattice scribe grooves in a fragile material substrate having a relatively large linear expansion coefficient and cutting.SOLUTION: The processing method is for irradiating a fragile material substrate with a pulse laser beam along lattice lines to be cut and includes the first process of scanning a pulse laser beam along lattice lines to be cut which extend in the first direction, in order to form the first scribe grooves, the second process of, after the formation of the first scribe grooves, radiating a pulse laser beam along lines to be cut which extend in the second direction perpendicular to the first direction, in such a manner that pulse laser beams do not overlap each other but that processed marks formed in the substrate by the pulse laser beam overlap each other, in order to form the second scribe grooves in the surface of the substrate and the third process of pressing both sides of each scribe groove to cut the substrate along each scribe groove.