CONDUCTIVE ADHESIVE AGENT AND ELECTRODE JUNCTION STRUCTURE AND SEMICONDUCTOR PACKAGE USING THE SAME

PROBLEM TO BE SOLVED: To provide a conductive adhesive agent useful for electrically connecting an electrode of an electronic component and an electrode of a package while maintaining reduction in connection resistance and reduction in thermal stress, without using a substrate dedicated to the elect...

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Bibliographische Detailangaben
Hauptverfasser:	ARAO OSAMU, NIIOBI AKIRA
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES PRINTED CIRCUITS USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a conductive adhesive agent useful for electrically connecting an electrode of an electronic component and an electrode of a package while maintaining reduction in connection resistance and reduction in thermal stress, without using a substrate dedicated to the electronic component, in manufacturing a semiconductor package.SOLUTION: A conductive adhesive agent contains at least a binder resin and (1) a conductive metal filler, (2) a reductant, and/or (3) an antioxidant, which are blended into the binder resin.