RESIN MOLDING

PROBLEM TO BE SOLVED: To provide a resin molding which is produced with a small number of working man-hours and a small number of assembling man-hours and has an excellent heat dissipation characteristic.SOLUTION: A part of a metal component 1 is embedded in a resin molding part 3 made of a thermopl...

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Bibliographische Detailangaben
Hauptverfasser:	KAMIHOGI YUTETSU, AGEO YOSHIAKI, IWATSUKI YASUHITO
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PRINTED CIRCUITS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a resin molding which is produced with a small number of working man-hours and a small number of assembling man-hours and has an excellent heat dissipation characteristic.SOLUTION: A part of a metal component 1 is embedded in a resin molding part 3 made of a thermoplastic resin composition and a heat generating component 5 is connected with an exposed part 1A of the metal component 1. Heat generated from the heat generating component 5 is dissipated to a heat sink 7 through the metal component 1 and a thermoplastic resin layer 3A which constitutes a part of the resin molding part 3. The thickness t of the thermoplastic resin layer 3A is 0.4 to 1 mm.