PICK-UP DEVICE OF SEMICONDUCTOR CHIP

PROBLEM TO BE SOLVED: To provide a pick-up device which can certainly remove a semiconductor chip pasted on an adhesive sheet without damaging, and correspond to various kinds of semiconductor chips.SOLUTION: A pick-up device of a semiconductor chip 10 pasted on an adhesive sheet 15, includes a housing 2 for supporting the semiconductor chip, and a claw portion 4 for pushing up the picked-up semiconductor chip. The housing is provided with a support surface and an opening portion 22. The claw portion has a claw tip end portion 41 for pushing up the semiconductor chip, a claw body bending portion 42, and a claw upper side other end portion. The claw body vending portion is provided with a hole portion through which a supporting pin 35 is inserted, and an in-housing slider portion 3 and an upper limit stopper portion 5 are provided in the housing. By sliding the in-housing slider portion, the supporting pin is raised to raise the claw tip end portion, and the claw upper side other end portion abuts on the upper limit stopper portion to close the claw tip end portion toward the inside of the semiconductor chip.