HARD FILM, METHOD FOR FORMING THE SAME, AND MEMBER COATED WITH HARD FILM

PROBLEM TO BE SOLVED: To provide a hard film having superior abrasion resistance compared to a TiAlN film or an oxide film being a conventional hard film.SOLUTION: The hard film to be formed on the surface of a substrate is comprised of (TiAlSi)Oin which the relations of: 0.3≤a≤0.7, 0.3≤b≤0.7, 0≤c≤0...

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Bibliographische Detailangaben
Hauptverfasser:	YAMAMOTO KENJI, NAKAKUBO SHOHEI
Format:	Patent
Sprache:	eng
Schlagworte:	BORING CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY MILLING PERFORMING OPERATIONS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING TURNING
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Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a hard film having superior abrasion resistance compared to a TiAlN film or an oxide film being a conventional hard film.SOLUTION: The hard film to be formed on the surface of a substrate is comprised of (TiAlSi)Oin which the relations of: 0.3≤a≤0.7, 0.3≤b≤0.7, 0≤c≤0.2, a+b+c=1 and 0.8≤[x/(2a+1.5b+2c)]≤1.2 are satisfied, or is comprised of (TiCrAlSi)Oin which the relations of: 0.05≤a≤0.4, 0.1≤d≤0.85, 0≤b≤0.7, 0≤c≤0.2, a+b+c+d=1 and 0.8≤[x/(2a+1.5d+1.5b+2c)]≤1.2 are satisfied, wherein a, d, b and c represent atomic ratios of Ti, Cr, Al and Si, and x represents an atomic ratio of O.