HEAT PRESS DEVICE AND METHOD FOR MANUFACTURING CIRCUIT BOARD USING THE SAME

PROBLEM TO BE SOLVED: To manufacture a superior circuit board without deformation of a through-hole by measuring a relative moving amount between hot plates of a heat press device and ensuring the invariable relative moving amount.SOLUTION: The heat press device is characterized in that measure mean...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HIRAISHI YUKIHIRO, FUKAZAWA HIROAKI, TAKENAKA TOSHIAKI
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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