HEAT PRESS DEVICE AND METHOD FOR MANUFACTURING CIRCUIT BOARD USING THE SAME

PROBLEM TO BE SOLVED: To manufacture a superior circuit board without deformation of a through-hole by measuring a relative moving amount between hot plates of a heat press device and ensuring the invariable relative moving amount.SOLUTION: The heat press device is characterized in that measure mean...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	HIRAISHI YUKIHIRO, FUKAZAWA HIROAKI, TAKENAKA TOSHIAKI
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To manufacture a superior circuit board without deformation of a through-hole by measuring a relative moving amount between hot plates of a heat press device and ensuring the invariable relative moving amount.SOLUTION: The heat press device is characterized in that measure means which measure the relative moving amount between the hot plates are attached to two adjacent hot plates. An omnidirectionaly deformable and highly flexible material is positioned between the hot plates, and the relative moving amount between the hot plates is measured while pressurized in a normal temperature state, thereby adjusting of the relative moving amount is facilitated and the invariable relative moving amount is ensured by using the heat press device. Accordingly, the superior circuit board without deformation of a through-hole is manufactured and provided.