POLISHING APPARATUS AND POLISHING METHOD
PROBLEM TO BE SOLVED: To provide a polishing apparatus adequately controlling a polishing allowance of a wafer with a simple structure.SOLUTION: The polishing apparatus 1 is provided with: a polishing head 3 formed by integrating a packing pad 32 with a retainer ring 33; a retainer liquid pressure-m...
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| creator | KOSASA KAZUAKI SUGIMORI KATSUHISA |
| description | PROBLEM TO BE SOLVED: To provide a polishing apparatus adequately controlling a polishing allowance of a wafer with a simple structure.SOLUTION: The polishing apparatus 1 is provided with: a polishing head 3 formed by integrating a packing pad 32 with a retainer ring 33; a retainer liquid pressure-measuring means 35 measuring the retainer liquid pressure Fr which the retainer ring 33 receives from slurry P on a polishing pad 23 during polishing of a wafer W; and a parameter setting means setting at least one parameter among head pressurizing force Fh applied to the polishing head 3 on the basis of the retainer liquid pressure Fr measured by the retainer liquid pressure measuring means 35, the rotation number of a surface plate 22 and polishing time per one batch. A polishing control means controls at least one of a rotation-driving means and a polishing head pressurizing means on the basis of the parameter set by the parameter setting means. |
| format | Patent |
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A polishing control means controls at least one of a rotation-driving means and a polishing head pressurizing means on the basis of the parameter set by the parameter setting means.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING |
| title | POLISHING APPARATUS AND POLISHING METHOD |
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