MOUNTING METHOD OF SEMICONDUCTOR SENSOR

PROBLEM TO BE SOLVED: To provide a mounting method of a semiconductor sensor capable of preventing the semiconductor sensor from inclining with respect to a mounted member.SOLUTION: In a process of forming a spacer 40, an arrangement step of placing a spacer material 41 at a predetermined position o...

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Bibliographische Detailangaben
Hauptverfasser: SHINYA HIROTAKA, OYA KOJI, NIIOBI AKIRA, IZUMI TAKAO
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a mounting method of a semiconductor sensor capable of preventing the semiconductor sensor from inclining with respect to a mounted member.SOLUTION: In a process of forming a spacer 40, an arrangement step of placing a spacer material 41 at a predetermined position on one surface of a mounted member 20 by means of a dispenser 70, and a hardening step of forming the spacer 40 by hardening the spacer material 41 are performed. Since the spacer material 41 is placed at a predetermined position of a mounted member 20 by means of a dispenser 70, and the spacer 40 is formed by hardening the spacer material 41, the spacer 40 is not placed intensively at a specific place of the mounted member 20. When a semiconductor sensor 10 is bonded to the mounted member 20, the semiconductor sensor 10 can be prevented from inclining with respect to the mounted member 20.