SUBSTRATE TREATING APPARATUS

PROBLEM TO BE SOLVED: To improve the adhesiveness of a conductive film on the surface of an organic substrate after ultraviolet irradiation, and preventing the decrease in the conductivity of the conductive film, by irradiating the surface of the organic substrate in an atmosphere containing a decre...

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Bibliographische Detailangaben
Hauptverfasser:	KAWAGUCHI KEIJI, NAGAHATA CHISEI, NAKAMURA MASARU, ISOKAWA YOSHINORI
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BASIC ELECTRIC ELEMENTS CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOIDCHEMISTRY CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC HEATING ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP THEIR RELEVANT APPARATUS TRANSPORTING WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To improve the adhesiveness of a conductive film on the surface of an organic substrate after ultraviolet irradiation, and preventing the decrease in the conductivity of the conductive film, by irradiating the surface of the organic substrate in an atmosphere containing a decreased amount of hydrogen with ultraviolet rays.SOLUTION: A substrate treating apparatus 1 feeds a dry air from a dry air cylinder 34 to the inside of a housing 30 in which the substrate 100 is arranged. The surface of the substrate 100 is irradiated with ultraviolet rays from an ultraviolet lamp 22 in an atmosphere of a dry air containing a sufficiently small amount of hydrogen through an irradiation window 21 and a filter 28.