PRINTED WIRING BOARD AND MANUFACTURING METHOD OF THE SAME

PROBLEM TO BE SOLVED: To provide a printed wiring board having small variations in diameters of blind vias and a manufacturing method of the printed wiring board.SOLUTION: A manufacturing method of a printed wiring board is described as follows. A through hole 41 reaching a conductive substrate 10 i...

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Bibliographische Detailangaben
Hauptverfasser:	KASUGA TAKASHI, OKA YOSHIO, PARK CHIN-JU, NAKAMA KOKI, UEHARA SUMITO, UENISHI NAOTA
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INFORMATION STORAGE INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHYSICS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a printed wiring board having small variations in diameters of blind vias and a manufacturing method of the printed wiring board.SOLUTION: A manufacturing method of a printed wiring board is described as follows. A through hole 41 reaching a conductive substrate 10 is formed in an insulation layer 20. A conductive ink containing conductive particles is applied to a region including the through hole 41 on the insulation layer 20 to form a conductive particle layer 31. Further, an electric plating layer 33 is formed on the conductive particle layer 31 by electric plating. Then, the conductive particle layer 31 and the electric plating layer 33, which are located around a blind via 40, are removed.